In recent years, relevant functional departments of the country have become increasingly strict in inspecting product quality. However, there are still some unethical businessmen who engage in illegal activities, leading to the proliferation of inferior and even counterfeit products in the market, resorting to any means necessary to improve their own interests. This behavior greatly undermines the rights and interests of consumers.

We have to admit that there is currently no chip manufacturing company in China with high-end technology like Intel, and foreign products are expensive. Therefore, some manufacturers have adopted the method of changing suppliers to achieve subcontracting. This behavior will lead to low product quality and low prices, and will have a significant impact on the normal economic development of the entire market.

In order to effectively detect the advantages and disadvantages of products, many testing equipment have appeared in the domestic market, such as ordinary AOI for ultrasonic testing, and now X-RAY non-destructive testing. The development and innovation of each testing equipment is aimed at checking product quality.

In fact, AOI can only inspect the appearance of the product, not the interior of the product. Although ultrasound testing is a non-destructive test, its disadvantage is that it cannot better preserve the test results. X-ray non-destructive testing will completely overcome the shortcomings of the first two testing methods. Not only can it detect internal defects of the product, but it can also save the analysis projection of the product in image form. This detection method is used for future analysis and comparison. Played a crucial role.

As the most widely used product in the market, one can imagine the importance of IC chip quality. Faced with IC chips on the market that have very realistic shapes but internal structural defects, it is obviously impossible to detect them with the naked eye. The difference is that only after precise and efficient detection of X-ray inspection equipment can these defects be well detected, thereby protecting the quality of IC chips.

In order to meet the requirements, new non-destructive testing technologies are constantly innovating. The application of automatic X-ray non-destructive testing technology is among the best. It can not only inspect invisible solder dots (such as BGA), but also qualitatively analyze the inspection results. Quantitative analysis makes it easy to detect problems early. Therefore, more companies need X-RAY testing equipment to improve product quality.

X-ray non-destructive testing technology has obvious characteristics: based on the understanding of various non-destructive testing technologies and equipment, X-ray non-destructive testing technology has more advantages than other non-destructive testing technologies. It can enhance everyone's detection system to a higher level. Provide reasonable inspection methods for everyone to improve the "one-time pass rate" and strive to achieve the goal of "zero defects".